SP300Di

SP300Di Specifications

This SP300Di is designed for small diameter hard materials like Sapphire, SiC, and Ceramics using diamond wire for high speed and high accuracy cutting.

Sapphire cover glass of smart phones is a new application of the material sliced by the precision in this machine.

Maximum work size
[mm]
⌀156 x L300 x 1 piece
Maximum work size
inch conversion
(nearest tenth)
⌀6.1 x L11.8 x 1 piece

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