ND450

This ND450 multi wire saw pushes new boundaries with its ability to cut wafers up to 18″ at varying thicknesses. It represents the future of slicing. Furthermore, the ND450 has been upgraded to accommodate diamond wire, saving precious cycle time and making the clean up easier.

   
Maximum work size ⌀18" x L450 x 1 piece

REQUEST MORE INFORMATION ON THE ND450...