MWM442DM

MWM442DM Specifications

The MWM442DM multi-wire saw was designed for slicing semiconductor wafers and solar cell wafers as well as wafers of a small diameter.

The MWM442DM is easy to use because of its compact design and is considered one of our best-selling machines.

Maximum work size
[mm]
□156 x L300 x 2 pieces
Maximum work size
inch conversion
(nearest tenth)
□6.1 x L11.8 x 2 pieces

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